Molybdenum Copper military power suitable for the manufacture of
microelectronic devices as a heat sink and tungsten
cubic the sealing material of
aluminum oxide ceramic sealing and structural materials
molybdenum-copper alloy rod, but also for the manufacture of
microelectronic devices civil power
Pieces of high thermal conductivity given inflation sealing heat sink with molybdenum copper alloy rod .
Molybdenum-copper
alloy of copper and molybdenum comprehensive advantages of high
strength, high specific gravity , high temperature resistance, arc
ablation , electric conductivity properties, tungsten
filaments good processing
performance. Using high -quality oxygen-free copper molybdenum powder
and powder , apply isostatic
Pressure molding ( high temperature
sintering - copper infiltration ) , to ensure product purity and
accuracy ratio, organized crime , and excellent performance. Breaking
arc resistance, electrical conductivity, thermal conductivity, thermal
expansion smaller.
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