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printed circuit manufacturing process is divided into categories that both methods? What are the advantages of each?
Addition: Avoid a lot of etching copper, reducing costs. Simplifies PCB copy board production process, improve production efficiency. Wires and can reach flush flush surface. Improves the reliability of plated through holes.
Subtractive: mature technology, stable and reliable.
Addition of printed circuit manufacturing process is divided into several categories? Were to write their processes?
Full Addition: drilling, imaging, thickening (negative phase), copper plating, the resist is removed.
Semi-additive method: drilling, catalytic processing, and thickening treatment, chemical plating, imaging (plating resist), pattern plating copper (negative phase), the resist is removed, the differential etching.
Part Addition: Imaging (anti-etching), etching of copper (positive phase), removing the resist layer, the entire board plating resist coating, drilling, hole copper plating, plating resist removal.
 subtractive process printed circuit divided into several categories? Write full board plating and electroplating process graphics.
Non-perforated plated PCB, PCB plating perforation, perforation plated PCB and surface mount printed circuit board.
Full board plating (masking method): double CCL cutting, drilling, hole molybdenum plating  full board plating thick, surface treatment, paste-type dry film photo-mask, made positive phase conductor pattern, etching, go to film, plugs plating, shape processing, testing, printing solder coating, hot air leveling, screen printing marker symbol, finished.
PCB copy board pattern plating (bare copper coated solder mask): Double-sided copper clad laminate cutting, positioning hole punch, CNC drilling, testing, deburring, thin copper plating, thin copper plating, inspection, brush plate, foil (or screen printing), exposed and developed (or curing), inspection retouching, graphics copper plating, pattern plating tin-lead alloy, to film (or removing printed materials), inspection retouching, etching, retreat pewter, through the circuit test , cleaning, solder graphics, plug nickel / gold, plugs taping, hot air leveling, cleaning, screen printing mark symbol, form processing, washing and drying, inspection, packing, finished.
electroplating technology which can be divided into several technologies?
Conventional PTH plating technology, direct plating technology, conductive adhesive technology.
The main features of the flexible printed circuit board what? Its base with what?
Can be bent fold, reducing the size; weight, wiring consistency, high reliability.
Just briefly - the main features of the flexible printed circuit board, use?
Rigid part fused, eliminating connectors, reliable, reduce weight, assembly miniaturization. PCB copy board is mainly used in medical electronic equipment, computers and peripherals, communications equipment, aerospace equipment, and defense and military equipment.
Brief characteristics of conductive adhesive PCB?
Machining process is simple, high efficiency, low cost, less waste.
What is Multiple wiring PCB?
The metal wire directly laid on an insulating substrate layered and made of printed circuit board.
What is the metal base PCB? Its main characteristic is what?
Metal substrate and the metal core PCB PCB collectively.
What is the single multi-layer PCB? Its main characteristic is what?
On a single-sided PCB fabrication of multilayer printed circuit boards. PCB copy board features: not only can inhibit the inside outward electromagnetic radiation, and it can prevent external electromagnetic interference, no hole metal, low cost, light weight, can be thin.
Brief laminated multilayer printed circuit defined and manufacturing?
The completed multilayer inner layer are alternately laminated to produce the insulating layer and the conductive layer, an application freely between the blind hole conduction, thereby forming a high density multi-layer printed circuit board wiring.