Electronic Packaging Materials

W-Cu electronic packaging materials, with both Tungsten eletrode low expansion properties, but also with copper's high thermal conductivity, it is particularly valuable is that its thermal expansion coefficient and thermal conductivity can be adjusted by the material composition and be designed so as to give the material application has brought great convenience. We use high-quality high-purity raw materials, molding, high temperature sintering and infiltration, got excellent performance of the W-Cu electronic packaging materials and heat sink material. For materials with high-power device package, such as a substrate, a lower electrode and the like; performance of the lead frame; military and civilian thermal control device such as thermal control board and the heatsink.
Advantages: a matrix that matches the type of thermal expansion coefficient and the high thermal conductivity; excellent high temperature stability and uniformity; excellent processing properties;
Specifications: Surface plating Ni, NiAu or electroless Ni W-Cu plate, the maximum size 100x100 mm, thickness 0.5-50mm